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Verification of Residual Properties of Surfactant Cleaning Performance in Low Stand-off Areas [Joint Research]

Directly caused by the generation of leakage current and deterioration of insulation resistance! Introducing cleaning know-how.

In the soldering process, excellent no-clean technology has been established in the Japanese market; however, there is an increasing number of cases where various challenges arise, and the demand for cleaning is growing year by year. One of the backgrounds for the continuously increasing demand for cleaning is the response to ionic residues. Ionic residues are fundamentally difficult to see and may change into various forms over time, directly leading to the occurrence of leakage currents and deterioration of insulation resistance. *For more details, please refer to the related links. *The PDF document is a technical material that explains the challenges and analysis methods related to ionic residues.

  • 活性剤(イオン成分)の洗浄性 低スタンドオフ部の残留性検証2.JPG
  • 活性剤(イオン成分)の洗浄性 低スタンドオフ部の残留性検証3.JPG
  • 活性剤(イオン成分)の洗浄性 低スタンドオフ部の残留性検証4.JPG
  • 活性剤(イオン成分)の洗浄性 低スタンドオフ部の残留性検証6.JPG
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